| Zugriffsnummer | 52292 |
| Dokumenttyp | Repository E-Print |
| Peer Review | mit Peer Review |
| Sprache | Englisch |
| Titel | Development of flip-chip technology for the optical drive of superconducting circuits |
| Autor(in); Institution |
Tian, Hao; 2.4, Quantenelektronik, PTB-Braunschweig
Priyadarshi, Shekhar; 2.4, Quantenelektronik, PTB-Braunschweig
Felgner, Judith; 2.4, Quantenelektronik, PTB-Braunschweig
|
| Quelle/Jahr | Open Research Europe:(2024), 1 - 14 |
| Artikelnummer | 4:97 |
| Availability | [online only] |
| ISSN | 2732-5121 (online) |
| DOI | |
| Verlag | Brussels: The European Commission |
| Freie Schlagworte | photodiode ; gold stud bumps ; flip chip technology ; superconducting quantum circuits ; cryo-electronics ; AC Josephson Voltage Standard ; JAWS |
| Zusammenfassung | We discuss the flip-chip mounting process of photodiodes and fiber sleeves on silicon substrates to meet the increasing demand for fabrication of highly integrated and hybrid quantum circuits for operation at cryogenic temperatures. To further increase the yield and success rate of the flip-chip procedure, the size of the gold stud bumps, and flip-chip parameters were optimized. Moreover, to connect optical fibers to the photodiodes in an optimal position, the fiber sleeves were aligned with specially fabricated alignment circles before applying thermocompression with the flip-chip machine. The mounted photodiodes were tested at both room temperature and cryogenic temperature, and we find that mechanical imperfections of the sleeve-ferrule combination limit the overall alignment accuracy. The experimental results show that our flip-chip process is very reliable and promising for various optical and electrical applications and, thus, paves the way for fabrication of hybrid chips, multi-chip modules and chip-on-chip solutions, which are operated at cryogenic temperatures. |
| Version | 1 |
| Kostenfreier Zugang | Open Access Gold |
| Rechteinformation | CC BY 4.0 ; Creative Commons Attribution 4.0 License |
| Themenbereich der Metrologie | Elektrizität und Magnetismus |
| Forschungsprojekt | 20FUN07: SuperQuant: Microwave metrology for superconducting quantum circuits ; German Federal Ministry of Education and Research (contract number: 13N15934) |
| Förderinformationen (1) |
Förderername: European Commission (EC)
Förderer ID: 0000 0001 2242 8989 Förderer ID Typ: ISNI Förderprogramm: EMPIR 2020 Fundamental Titel der Förderung: 20FUN07: SuperQuant: Microwave metrology for superconducting quantum circuits Förderungsnummer: 20FUN07 |
| Förderinformationen (2) |
Förderername: Bundesministerium für Bildung und Forschung (BMBF)
Förderer ID: 0000 0000 9090 0344 Förderer ID Typ: ISNI Förderungsnummer: 13N15934 |