| Zugriffsnummer | 51671 |
| Dokumenttyp | Zeitschriftenartikel |
| Peer Review | mit Peer Review |
| Sprache | Englisch |
| Titel | A new magnetic enhanced chemical mechanical polishingmethod for quartz glass slender holes |
| Autor(in); Institution |
Guo, Jiang; Technische Universität Dalian, Dalian, CHINA
Qin, Pu; Technische Universität Dalian, Dalian, CHINA
Qikai, Li; Technische Universität Dalian, Dalian, CHINA
Xu, Zhu; Technische Universität Dalian, Dalian, CHINA
Wang, Chunjin; Polytechnische Universität Hongkong, Hongkong, CHINA
Chi Fai, Cheung; Polytechnische Universität Hongkong, Hongkong, CHINA
|
| Quelle/Jahr | Journal of Materials Processing Technology: 327 (2024), 1 - 14 |
| Artikelnummer | 118361 |
| ISSN | 0924-0136 (print) ; 1873-4774 (online) |
| DOI | |
| URL | |
| Verlag | Amsterdam: Elsevier |
| Freie Schlagworte | polishing ; inner surface ; slender hole ; multi-field |
| Zusammenfassung | Due to the limitations of tool size, field assisted polishing methods are often employed for polishing the internalsurfaces of slender holes with large aspect ratios. However, in existing polishing methods, fields are often applied inisolation, which limits the ability to obtain high surface quality. Furthermore, it is rare for polishing method studiesto fully leverage the advantages of multiple fields to create a synergistic effect. Therefore, developing a polishingmethod that harnesses the synergistic interaction of multiple fields, and revealing the polishing mechanism, iscrucial for achieving high-quality internal surfaces of quartz slender holes. To address this problem, a novelmagnetic enhanced chemical mechanical polishing method was proposed in this paper and a systematic processstudy was carried out to analyze the synergistic effects of magnetic and chemical fields. To evaluate the effects ofprocess parameters on material removal and forecast MRR, the material removal process was modeled andvalidated based on the consistency between experimental and theoretical values. Suitable process parameters aredetermined through experiments and analysis on magnetic field distribution and process parameters. Byconducting EDS mapping and XPS analyses on the reaction product, the enhancement mechanism of magnetic fieldon material removal in the chemical mechanical polishing process was identified. Under the assistance of amagnetic field, the magnetic abrasive particles encircle the particles to fully contact the workpiece surface.The contact force between the polishing tool and the workpiece surface increase. Both of the effects promote thechemical reaction and enable the reaction layer on the surface to be removed in time to obtain higher surface quality. As a result, this method achieves high-efficiency and high-quality polishing, significantly reducing thesurface roughness Sa of slender holes from 0.3 μm to 77 nm, with a material removal rate of 141 μm/h. |
Zitierung
Guo, J., Qin, P., Qikai, L., Xu, Z., Dai, G., Wang, C., & Chi Fai, C. (2024). A new magnetic enhanced chemical mechanical polishingmethod for quartz glass slender holes. Journal of Materials Processing Technology, 327, 1–14. https://doi.org/10.1016/j.jmatprotec.2024.118361