| Zugriffsnummer | 49546 |
| Dokumenttyp | Konferenzartikel |
| Peer Review | unbekannt |
| Sprache | Englisch |
| Titel | On-wafer test structures for the evaluation of signal integrity and power integrity at chip level |
| Autor(in); Institution |
Pham, Thi Dao; Laboratoire national de métrologie et d’essais (LNE), Paris, FRANCE
Lahbacha, Khitem; University of Cassino and Southern Lazio, Cassino, ITALY
Maffucci, Antonio; University of Cassino and Southern Lazio, Cassino, ITALY
Miele, Gianfranco; University of Cassino and Southern Lazio, Cassino, ITALY
Allal, Djamel; Laboratoire national de métrologie et d’essais (LNE), Paris, FRANCE
|
| Quelle/Jahr | 2022 Conference on Precision Electromagnetic Measurements (CPEM), Wellington, New Zealand:(2022), 2 S. |
| Konferenzangaben | Conference on Precision Electromagnetic Measurements (CPEM 2022), Wellington, 12-16, December, 2022, New Zealand |
| Freie Schlagworte | Thin film ; TFMSL ; SU-8 ; Signal Integrity ; SI ; Power Integrity ; PI ; FPGA ; test structure |
| Zusammenfassung | This paper describes the design of thin film microstrip line (TFMSL) coupled test structures operating up to 50 GHz, with the aim to evaluate the impact of Signal Integrity (SI) and Power Integrity (PI) on Field Programmable Gate Array (FPGA) chips. Indeed, reliable high-speed data transfer and highspeed electronic components require high levels of SI in order to be capable of handling hundreds of channels and thousands of input/output connections on a single chip. The test structures are designed to be etched on SU-8 resin thin film and be used to characterize SI and PI related performance parameters such as reflections, distortions, crosstalk, and power distribution network voltage drops, applicable to the chip level of FPGA circuits. |
| Themenbereich der Metrologie | Elektrizität und Magnetismus |
| Forschungsprojekt | 20IND03: FutureCom: RF Measurements for future communications applications |
| Förderinformationen (1) |
Förderername: European Commission (EC)
Förderer ID: 0000 0001 2242 8989 Förderer ID Typ: ISNI Förderprogramm: EMPIR 2020 Industry Titel der Förderung: 20IND03: FutureCom: RF Measurements for future communications applications Förderungsnummer: 20IND03 |
Zitierung
Pham, T. D., Phung, G. N., Lahbacha, K., Maffucci, A., Miele, G., Arz, U., & Allal, D. (2022). On-wafer test structures for the evaluation of signal integrity and power integrity at chip level. Conference on Precision Electromagnetic Measurements (CPEM 2022), Wellington, 12-16, December, 2022, New Zealand.