Using the finite element method (FEM), we developed a simulation model based on our actual apparatus, which is used for measuring the Seebeck coefficient and the electrical conductivity of thermoelectric materials. In terms of geometry, materials, and physics, our simulation model corresponds to the essential details of the experimental device. This article describes the model in detail and highlights key technical characteristics. By comparing it with actual measurement results, the accuracy of the model has been verified. Based on this accurate model, a simulation comparison study on the changes of certain parameters was carried out. Finally, the results of these comparisons are discussed to gain a deeper understanding of the actual experimental process and to improve the accuracy of the measurement.
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CC BY 4.0 ; Creative Commons Attribution 4.0 License
Zitierung
Huang, K. & Edler, F. (2022). Multiphysics simulation of Seebeck coefficient measurement. Journal of Electronic Materials, 51(6), 3276–3287. https://doi.org/10.1007/s11664-022-09577-9
