| Zugriffsnummer | 46708 |
| Dokumenttyp | Konferenzartikel |
| Peer Review | unbekannt |
| Sprache | Englisch |
| Titel | Impact of chuck boundary conditions on wideband on-wafer measurements |
| Autor(in); Institution |
Phung, Gia Ngoc; 2.2, Hochfrequenz und Felder, PTB-Braunschweig
Arz, Uwe; 2.2, Hochfrequenz und Felder, PTB-Braunschweig
|
| Quelle/Jahr | 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI):(2021), 1 - 4 |
| ISBN | 978-1-6654-2388-5 (electronic) ; 978-1-6654-2389-2 (PoD) |
| DOI | |
| Verlag | Piscataway, NJ: IEEE |
| Konferenzangaben | 25th IEEE Workshop on Signal and Power Integrity (SPI), Virtual Conference, 10-12, May, 2021 |
| Freie Schlagworte | coplanar waveguides ; leakage ; radiation ; surface waves |
| Zusammenfassung | While a lot of investigations have been presented recently explaining the parasitic effects in on-wafer measurements caused by probes, neighborhood and environmental effects, this paper addresses the impact of chuck boundary conditions. Starting from a coplanar waveguide (CPW) measurement example, this paper demonstrates how the most relevant chuck parameters, i.e. thickness and relative permittivity, deteriorate the S-parameters of CPWs. |
| Themenbereich der Metrologie | Elektrizität und Magnetismus |