| Zugriffsnummer | 37663 |
| Dokumenttyp | Konferenzartikel |
| Sprache | Englisch |
| Titel | Packaging of fiber-coupled module for Josephson junction array voltage standards |
| Autor(in); Institution |
Bardalen, Eivind; University College Southeast Norway, Tønsberg, NORWAY
Nguyen, Thai Anh Tuan; University College Southeast Norway, Tønsberg, NORWAY
Malmbekk, Helge; Justervesenet (JV), Kjeller, NORWAY
Kieler, Oliver; 2.4, Quantenelektronik, PTB-Braunschweig
Ohlckers, Per; University College Southeast Norway, Tønsberg, NORWAY
|
| Quelle/Jahr | 2016 Conference on Precision Electromagnetic Measurements (CPEM 2016):(2016), 1 - 2 |
| ISBN | 978-1-4673-9134-4 (online) ; 978-1-4673-9132-0 (CD-ROM) ; 978-1-4673-9135-1 (PoD) |
| DOI | |
| Verlag | Piscataway, NJ: IEEE |
| Konferenzangaben | Conference on Precision Electromagnetic Measurements (CPEM) 2016, Ottawa, 10-15, July, 2016, Canada |
| Freie Schlagworte | thermal cycling ; Cryogenic packaging ; measurement standards ; Josephson junctions ; thermomechanical simulations ; optical simulations ; flip-chip bonding ; adhesive bonding |
| Zusammenfassung | This paper describes issues related to the packaging of a fiber coupled optoelectronic module intended as a current source for pulse-driven Josephson arrays, operating at cryogenic temperatures. The module consists of flip-chip bonded photodiodes on a silicon carrier with adhesively bonded optical fiber components in a compact package. Optical and thermomechanical simulations were performed, showing that the needed functionality can be achieved, with optical coupling efficiency above 90% for fiber-chip misalignments up to 40 μm, and that the thermomechanical stresses can be reduced by controlling of the adhesive bonding process. |
Zitierung
Bardalen, E., Nguyen, T. A. T., Malmbekk, H., Kieler, O., & Ohlckers, P. (2016). Packaging of fiber-coupled module for Josephson junction array voltage standards. Conference on Precision Electromagnetic Measurements (CPEM) 2016, Ottawa, 10-15, July, 2016, Canada. https://doi.org/10.1109/cpem.2016.7540561