| Zugriffsnummer | 37530 |
| Dokumenttyp | Konferenzartikel in Zeitschrift |
| Peer Review | mit Peer Review |
| Sprache | Englisch |
| Titel | Direct-reading resonant silicon cantilever for probing of surface deposits. |
| Autor(in); Institution |
Zhang, Shuo; Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, GERMANY
Ding, Yichao; Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, GERMANY
Wu, Wenze; Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, GERMANY
Bertke, Maik; Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, GERMANY
Wasisto, Hutomo Suryo; Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, GERMANY
Doering, Lutz; 5.1, Oberflächenmesstechnik, PTB-Braunschweig
Brand, Uwe; 5.1, Oberflächenmesstechnik, PTB-Braunschweig
Peiner, Erwin; Technische Universität Braunschweig, Institute of Semiconductor Technology (IHT) and Laboratory for Emerging Nanometrology (LENA), Braunschweig, GERMANY
|
| Quelle/Jahr | Procedia Engineering: 168 (2016), 658 - 661 |
| Availability | [online only] |
| ISSN | 1877-7058 |
| DOI | |
| Verlag | Amsterdam: Elsevier |
| Konferenzangaben | 30th Eurosensors Conference, Budapest, 04-07, September, 2016, Hungary |
| Freie Schlagworte | thin-film metrology ; viscoelasticity ; contact resonance method ; MEMS technology |
| Zusammenfassung | Contact resonance spectroscopy measurements on thin film deposits based on a tactile piezoresistive silicon microcantilever probe are described. Direct-reading capability during linescans across selectively thin-film-deposited areas of an artefact surface is demonstrated using a phase-locked-loop circuit (PLL). Good agreement found with frequency-sweep measurements followed by line-shape analysis (LSA) including non-linear damping confirm the high potential of the proposed method for nondestructive inline manufacturing-process metrology. |
| Kostenfreier Zugang | Open Access Gold |
| Rechteinformation | CC BY-NC-ND 4.0 ; Creative Commons Attribution NonCommercial NoDerivatives 4.0 License |