| Zugriffsnummer | 32483 |
| Dokumenttyp | Zeitschriftenartikel |
| Sprache | Englisch |
| Titel | Hollow cathode discharge sputtering device for uniform large area thin film deposition |
| Autor(in); Institution |
Koch, Hans; 9.33, Kryoelektronik, PTB-Berlin
Friedrich, L. J.; University of Alberta, Department of Physics, Edmonton, CANADA
Hinkel, V.; Humboldt-Universität Berlin, Fachbereich Physik, Berlin, GERMANY
Ludwig, F.; Humboldt-Universität Berlin, Fachbereich Physik, Berlin, GERMANY
Politt, B.; Humboldt-Universität Berlin, Fachbereich Physik, Berlin, GERMANY
Schurig, Thomas; 9.33, Kryoelektronik, PTB-Berlin
|
| Quelle/Jahr | Journal of Vacuum Science and Technology A: 9 (1991), 4 |
| ISSN | 0734-2101 |
| DOI | |
| Verlag | New York, NY: AIP |
| Freie Schlagworte | Sputter deposition ; Cathodes ; Thin film deposition |
| Zusammenfassung | Hollow cathode discharges produce higher densities of sputtered particles than conventional discharges and can be utilized for thin film deposition. A prototype hollow cathode sputter source has therefore been built and tested. The deposition of copper and the superconductor YBa2Cu3O7−x produced thin films of good quality. The method can be upscaled for a uniform deposition of tapes, wires, large‐area substrates, and for the parallel deposition of multiple substrates. |
