| Zugriffsnummer | 30510 |
| Dokumenttyp | Konferenzartikel |
| Peer Review | unbekannt |
| Sprache | Englisch |
| Titel | Coordinate measurement on wafer level - from single sensors to sensor arrays |
| Autor(in); Institution |
Krah, Thomas; 5.3, Koordinatenmesstechnik, PTB-Braunschweig
Wedmann, Achim; 5.3, Koordinatenmesstechnik, PTB-Braunschweig
Kniel, Karin; 5.3, Koordinatenmesstechnik, PTB-Braunschweig
Härtig, Frank; 5.3, Koordinatenmesstechnik, PTB-Braunschweig
Ferreira, Nelson; TU Braunschweig, Institute for Microtechnology, Braunschweig, GERMANY
Büttgenbach, S.; TU Braunschweig, Institute for Microtechnology, Braunschweig, GERMANY
|
| Quelle/Jahr | Proceedings of the 2013 7th International Conference on Sensing Technology (ICST 2013):(2013), 616 - 621 |
| Availability | [USB-Stick] ; file name: 1569816551.pdf |
| Herausgeber(in) |
Mason, A.
|
| ISBN | 978-1-4673-5221-5 |
| DOI | |
| Verlag | Piscataway, NJ: IEEE |
| Konferenzangaben | Seventh International Conference on Sensing Technology (ICST 2013), Wellington, 03-05, December, 2013, New Zealand |
| Freie Schlagworte | 3D micro probing ; tactile coordinate measurement ; sensor array ; probe tips |
| Zusammenfassung | Systems fabricated in microtechnological processes are increasingly employed in industrial products. For that purpose, it is necessary to have a method at hand to measure them, just as macroscopic components and systems too, for reasons of quality assurance. Whereas there already exist a multitude of different systems based on diverse measurement principles for the measurement of single microsystems, a cost-effective measurement of a large number of microsystems on wafer level is currently realizable with optical measurement systems only, a fact that owes less to a technical advantage than to a faster measurement rate. This article portrays arrays fit for a parallelized tactile measurement of geometric dimensions and mechanical qualities of microsystems on a wafer. Moreover, it introduces innovative tactile elements for various measuring tasks and structures to be measured. |
Zitierung
Krah, T., Wedmann, A., Kniel, K., Härtig, F., Ferreira, N., & Büttgenbach, S. (2013). Coordinate measurement on wafer level - from single sensors to sensor arrays. Seventh International Conference on Sensing Technology (ICST 2013), Wellington, 03-05, December, 2013, New Zealand. https://doi.org/10.1109/icsenst.2013.6727726