| Zugriffsnummer | 27626 |
| Dokumenttyp | Konferenzartikel |
| Peer Review | unbekannt |
| Sprache | Englisch |
| Titel | Silicon based sensors and functional components fabricated by ICP-RIE cryogenic dry etching |
| Autor(in); Institution |
Merzsch, S.; TU Braunschweig, Institute of Semiconductor Technology, Braunschweig, GERMANY
Kähler, J.; TU Braunschweig, Institute of Semiconductor Technology, Braunschweig, GERMANY
Wasisto, H. S.; TU Braunschweig, Institute of Semiconductor Technology, Braunschweig, GERMANY
Doering, Lutz; 5.1, Oberflächenmesstechnik, PTB-Braunschweig
Brand, Uwe; 5.1, Oberflächenmesstechnik, PTB-Braunschweig
Waag, A.; TU Braunschweig, Institute of Semiconductor Technology, Braunschweig, GERMANY
Peiner, Erwin; TU Braunschweig, Institute of Semiconductor Technology, Braunschweig, GERMANY
|
| Quelle/Jahr | 23rd Micromechanics and Microsystems Europe Workshop:(2012) |
| Availability | [Electronic version] |
| Herausgeber(in) |
Scharff, Peter
|
| ISBN | 978-3-938843-71-0 |
| URL | |
| Verlag | Ilmenau: Verl. ISLE |
| Konferenzangaben | 23rd Micromechanics and Microsystems Europe Workshop, Ilmenau, 09-12, September, 2012, Germany |
| Freie Schlagworte | Cryogenic reactive ion etching ; Silicon grid ; Silicon on insulator |
| Zusammenfassung | In this paper we present a broad summary on etching results achieved by inductively coupled plasma (ICP) cryogenic dry etching. Those structures include thin cantilevers, sensors for nanoforce detection, vibration sensors and silicon grids. Due to high selectivity between resist and silicon ICP cryogenic dry etching offers the possibility to use thin photoresist masking. By varying the flux of oxygen and temperature, the etched shape was controlled in the individual cases. A challenge was the thermal coupling to keep the temperature at a low level even for high aspect ratios. |
Zitierung
Merzsch, S., Kähler, J., Wasisto, H. S., Doering, L., Brand, U., Waag, A., & Peiner, E. (2012). Silicon based sensors and functional components fabricated by ICP-RIE cryogenic dry etching. 23rd Micromechanics and Microsystems Europe Workshop, Ilmenau, 09-12, September, 2012, Germany.