Zugriffsnummer 16205
Dokumenttyp Konferenzartikel
Sprache Englisch
Titel Metrological characterization of nanometer film thickness standards for XRR and ellipsometry applications
Autor(in); Institution
Hasche, Klaus; 5, Fertigungsmesstechnik, PTB-Braunschweig
Thomsen-Schmidt, Peter; 5.1, Nano- und Mikrometrologie, PTB-Braunschweig
Krumrey, Michael; 7.12, Röntgenradiometrie, PTB-Berlin
Ade, George; 2.4, Quantenelektronik, PTB-Braunschweig
Ulm, Gerhard; 7.1, Photonenradiometrie, PTB-Berlin
Stümpel, Jürgen; 5.1, Nano- und Mikrometrologie, PTB-Braunschweig
Schaedlich, Stefan; Fraunhofer-Institute for Material and Beam Technology (IWS), Dresden, GERMANY
Frank, Wilfried; Institute for Surface Modification (IOM), Leipzig, GERMANY
Procop, Mathias; Bundesanstalt für Materialforschung und -prüfung (BAM), Berlin, GERMANY
Beck, Uwe; Bundesanstalt für Materialforschung und -prüfung (BAM), Berlin, GERMANY
Quelle/Jahr Recent developments in traceable dimensional measurements II:(2003), 165 - 172
Schriftenreihe Proceedings of SPIE: 5190
Herausgeber(in)
Decker, Jennifer E.
ISSN 0277-786X
ISBN 0-8194-5063-4
Verlag Bellingham, Wash.: SPIE
Konferenzangaben Recent Developments in Traceable Dimensional Measurements II, San Diego, California, 4-6, August, 2003, USA
Zusammenfassung Two types of film thickness standards have been developed, manufactured and investigated - for X-ray reflectometry(XRR), X-ray fluorescence analysis (XRF), electron probe micro analysis (EPMA) on the one hand, and ellipsometry on the other. Metrological characterization of both specific kinds of material measures and investigation results achieved are reported. The standards for XRR, XRF and EPMA consist of fused silica substrate coated with Pt resp. a C-Ni-C-layer-system with a nominal metal layer thickness of 10 nm alternatively 50 nm. XRR proved to be dominant investigation method. Apart from film thickness characteristics like film variances, interdiffusion between substrate and film have been analyzed. The standards for calibration of ellipsometer used for film thickness determination consist of an Sisubstrate and an SiO2-film. Tey are provided with an additional topographic structure making a topographic film thickness determination (approximately) possible. Film thickness determinations were effected by XRR and Scanning Force Microscopy in combination with Transmission Electron Microscopy as well as various ellipsometrical techniques. The nominal values of film thickness are between 6 nm and 1000 nm. The consistency of results found by different measurement techniques is discussed.

Zitierung

Hasche, K., Thomsen-Schmidt, P., Krumrey, M., Ade, G., Ulm, G., Stümpel, J., Schaedlich, S., Frank, W., Procop, M., & Beck, U. (2003). Metrological characterization of nanometer film thickness standards for XRR and ellipsometry applications. Recent Developments in Traceable Dimensional Measurements II, San Diego, California, 4-6, August, 2003, USA.

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