Zugriffsnummer 12486
Dokumenttyp Konferenzartikel in Zeitschrift
Sprache Englisch
Titel Fabrication of metallic multilayer single electron tunneling devices using low-energy e-beam lithography
Autor(in); Institution
Weimann, Thomas; 2.404, Elektronenstrahlmikroskopie und -lithographie, PTB-Braunschweig
Scherer, Hansjörg; 2.42, Metallische Strukturen, PTB-Braunschweig
Hinze, Peter; 2.404, Elektronenstrahlmikroskopie und -lithographie, PTB-Braunschweig
Niemeyer, Jürgen; 2.4, Quantenelektronik, PTB-Braunschweig
Quelle/Jahr Microelectronic Engineering: 53 (2000), 225 - 228
ISSN 0167-9317
Verlag Amsterdam [u.a.]: Elsevier Science
Konferenzangaben Micro- and Nano-Engineering 1999, Rome, 21-23, September, 1999, Italy
Freie Schlagworte single electron tunneling ; nanoscale device ; e-beam lithography
Zusammenfassung In this paper we present a newly developed multilayer technique for the fabrication of single electron tunneling (SET) devices, which is based on low-energy e-beam lithography. The separate functional layers of the SET devices are formed in individual lithography steps. This lithography allows a three-dimensional resist mask to be formed, which can be transferred onto the substrate by a lift-off or etching process. Several SET transistors have been fabricated by this method, which differ in the chosen material and show clear SET effects.

Zitierung

Weimann, T., Scherer, H., Hinze, P., & Niemeyer, J. (2000). Fabrication of metallic multilayer single electron tunneling devices using low-energy e-beam lithography. Microelectronic Engineering, 53, 225–228.

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