| Zugriffsnummer | 10591 |
| Dokumenttyp | Konferenzartikel |
| Sprache | Englisch |
| Titel | Silicon springs for the calibration of the force of hardness testing instruments and tactile profilometers |
| Autor(in); Institution |
Brand, Uwe; 5.1, Nano- und Mikrometrologie, PTB-Braunschweig
Doering, Lutz; 5.1, Nano- und Mikrometrologie, PTB-Braunschweig
Frühauf, Joachim; TU Chemnitz, Chemnitz, GERMANY
Gärtner, Eva; TU Chemnitz, Chemnitz, GERMANY
|
| Quelle/Jahr | Proceedings of the 4th euspen International Conference : May 31st - June 2nd 2004, Glasgow, Scotland, UK:(2004), 362 - 363 |
| Herausgeber(in) |
European Society for Precision Engineering and Nanotechnology
|
| ISBN | 1-861-94108-0 |
| Verlag | Bedford: European Society for Precision Engineering and Nanotechnology |
| Konferenzangaben | 4th International Conference of the European Society for Precision Engineering and Nanotechnology, Glasgow, 31, May - 2, June, 2004, Scotland |
| Zusammenfassung | Microstructured Si-springs of bridge type or cantilever type are successfully tested as material measures for the determination of probing forces of micro hardness testing instruments and of stylus surface profilers. The properties of silicon guarantee the thermo mechanical stability. The bridge springs are suitable for the calibration of micro hardness instruments because of a larger tolerance of the loading point in the symmetric middle part. In combination with a structure stopping the bending, an absolute calibration of force and deflection is possible. The profile over a cantilever reflects directly the measuring force. The main problem results from deformations of the spring systems because of internal stresses producing a zero load bending. |
Zitierung
Brand, U., Doering, L., Frühauf, J., & Gärtner, E. (2004). Silicon springs for the calibration of the force of hardness testing instruments and tactile profilometers. 4th International Conference of the European Society for Precision Engineering and Nanotechnology, Glasgow, 31, May - 2, June, 2004, Scotland.